14 September 2026 – SWISSto12 today announced a memorandum of understanding (MoU) with Mitsubishi Electric Corporation (MELCO) to pursue joint opportunities on advanced payloads, radio frequency (RF) products, and market development in Japan and the APAC region. Joint opportunities will leverage MELCO’s extensive satellite system expertise and integration capabilities together with SWISSto12’s proprietary 3D-printing designs and processes that form the foundation of its next-generation payloads—smaller, lighter, highly performant, yet built in materially shorter timeframes. The MoU underscores growing market adoption of SWISSto12’s HummingLink payload technology that leverages 3D-printing, with more than 2,000 products already in orbit enabling a wide range of customer missions. In addition to this MoU, MELCO has awarded SWISSto12 a contract to provide advanced phased array antenna products for the GEO secure communications programme of the Japanese Government. Read more